A case study of high pin count area array ceramic package crack

Author

Ghahghahi, Farshad ; Chung, Tom C.

Author_Institution

Tandem Comput. Inc., Cupertino, CA, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

917

Lastpage

921

Abstract

The need for higher circuit density on a integrated circuit (IC) with high pin count requires a large substrate size package to accommodate its wiring. This paper presents issues, approaches, and solutions for a high pin count (447 pins) microprocessor ceramic packaging with a focus on the package cracking. The effects of printed circuit board thickness, package standoff height, and environmental conditions on high pin count ceramic pin grid array (CPGA) package cracking are reviewed and discussed

Keywords

ceramics; cracks; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; probability; thermal analysis; thermal stresses; PCB thickness; area array ceramic package; ceramic PGA; ceramic package cracking; environmental conditions; high pin count package; integrated circuit; microprocessor ceramic packaging; package standoff height; pin grid array; printed circuit board thickness; Assembly; Ceramics; Computer aided software engineering; Integrated circuit packaging; Pins; Printed circuits; Soldering; Temperature; Tensile stress; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.517799

Filename

517799