DocumentCode
2703915
Title
Craze and instability of polyimide thin films and its effects on high density interconnects
Author
Wu, Sean X. ; Yeh, Chao-pin ; Wyatt, Karl ; Pecht, Michael
Author_Institution
Corp. Manuf. Res. Center, Motorola Inc., Schaumburg, IL, USA
fYear
1995
fDate
21-24 May 1995
Firstpage
922
Lastpage
924
Abstract
Stress-strain oscillation occurred prior to the appearance of necking deformation in tensile tests of polyimide films. This oscillation appears to be related to initiation and propagation of craze, rather than neck deformation. Both temperature and strain rate have a significant affect on oscillation. The effects of craze initiation and propagation on reliability of high density interconnects are discussed
Keywords
cracks; crazing; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; polymer films; stability; stress-strain relations; tensile testing; HDI reliability; craze initiation; craze propagation; crazing; high density interconnects; instability; necking deformation; polyimide thin films; strain rate; stress-strain oscillation; tensile tests; Capacitive sensors; Conducting materials; Glass; Optical materials; Polyimides; Polymers; Temperature; Testing; Thermal conductivity; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.517800
Filename
517800
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