• DocumentCode
    270396
  • Title

    Dark Silicon — A thermal perspective

  • Author

    Henkel, Jörg

  • Author_Institution
    Karlsruhe Inst. of Technol., Karlsruhe, Germany
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. Dark Silicon is predicted to dominate the chip footage of upcoming many-core systems within a decade since Dennard Scaling fails mainly due to the voltage-scaling problem that results in higher power densities. It would deem upcoming technologies nodes inefficient since a majority of cores would lie fallow. International research efforts have recently started to investigate and mitigate Dark Silicon effects to ensure an effective use of available chip footage. The talk starts with an overview of state-of-the-art in Dark Silicon research and how it is driven by thermal constraints. Besides background on thermal issues and its impact on reliability, effective solutions are presented that scale especially with respect to many-core systems.
  • Keywords
    elemental semiconductors; integrated circuit reliability; microprocessor chips; silicon; thermal engineering; Dennard scaling; Si; dark silicon; many-core systems; power density; reliability; thermal constraints; voltage-scaling problem; Reliability; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2014.6834935
  • Filename
    6834935