DocumentCode
2704019
Title
Using transition test to understand timing behavior of logic circuits on UltraSPARCTM T2 family
Author
Chen, Liang-Chi ; Dickinson, Paul ; Dahlgren, Peter ; Davidson, Scott ; Caty, Olivier ; Wu, Kevin
Author_Institution
Sun Microsyst., Sunnyvale, CA, USA
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
10
Abstract
Delay test is crucial for finding slow paths and slow ICs, both during bringup and during speed binning. Path delay test has traditionally been considered to be superior in finding slow paths. This paper describes our experiments indicating that this is not always the case. For the UltraSPARC T2 microprocessor series we found that transition delay test often ran slower, was more effective in finding the root cause of the slow path, and correlated well with functional diags also used for speed binning. Transition test does a better job finding delay issues related to the impact of simultaneous switching and coupling noise on chip speed. We used transition test to measure the impact on chip timing of voltage, temperature, and we also used it to confirm the results of improving slow paths.
Keywords
delays; integrated circuit testing; integrated logic circuits; logic testing; microprocessor chips; IC; UltraSPARC T2 microprocessor series; chip speed; chip timing; coupling noise; logic circuits; path delay test; speed binning; switching; timing behavior; transition delay test; Circuit testing; Delay effects; Logic circuits; Logic testing; Microprocessors; Radio access networks; Semiconductor device measurement; Temperature; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355655
Filename
5355655
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