• DocumentCode
    2704094
  • Title

    Harsh military environments and microelectromechanical (MEMS) devices

  • Author

    Brown, T. Gordon

  • Author_Institution
    U.S. Army Res. Lab., APG, MD, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    22-24 Oct. 2003
  • Firstpage
    753
  • Abstract
    The harsh military environment including operational requirements (temperature, pressure, acceleration and vibration) is described for a few munition applications. A summary of ground based experimentation pertaining to MEMS devices is presented. Results of a high-g shock study suggest that some Microelectromechanical (MEMS) sensors are rugged enough to survive both low-g and high-g launch. Small sensitivities to temperature, shock and vibration are described for a MEMS angular rate sensor. Flight experiments with artillery and rockets instrumented with MEMS angular rate sensors, accelerometers, and telemetry units, were recently completed. Analysis of the angular rate sensor data show encouraging results for surviving and measuring munition pitching and yawing behavior. There is mention of future military applications for MEMS and needed requirements to enable a successful transition.
  • Keywords
    acceleration measurement; microsensors; missiles; rockets; telemetry; MEMS angular rate sensor; MEMS devices; acceleration; accelerometers; artillery; harsh military environments; high-g shock study; microelectromechanical devices; munition applications; operational requirements; pressure; rockets; telemetry units; temperature; vibration; Acceleration; Electric shock; Instruments; Land surface temperature; Microelectromechanical devices; Micromechanical devices; Rockets; Sensor phenomena and characterization; Temperature sensors; Weapons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2003. Proceedings of IEEE
  • Print_ISBN
    0-7803-8133-5
  • Type

    conf

  • DOI
    10.1109/ICSENS.2003.1279042
  • Filename
    1279042