DocumentCode
2704094
Title
Harsh military environments and microelectromechanical (MEMS) devices
Author
Brown, T. Gordon
Author_Institution
U.S. Army Res. Lab., APG, MD, USA
Volume
2
fYear
2003
fDate
22-24 Oct. 2003
Firstpage
753
Abstract
The harsh military environment including operational requirements (temperature, pressure, acceleration and vibration) is described for a few munition applications. A summary of ground based experimentation pertaining to MEMS devices is presented. Results of a high-g shock study suggest that some Microelectromechanical (MEMS) sensors are rugged enough to survive both low-g and high-g launch. Small sensitivities to temperature, shock and vibration are described for a MEMS angular rate sensor. Flight experiments with artillery and rockets instrumented with MEMS angular rate sensors, accelerometers, and telemetry units, were recently completed. Analysis of the angular rate sensor data show encouraging results for surviving and measuring munition pitching and yawing behavior. There is mention of future military applications for MEMS and needed requirements to enable a successful transition.
Keywords
acceleration measurement; microsensors; missiles; rockets; telemetry; MEMS angular rate sensor; MEMS devices; acceleration; accelerometers; artillery; harsh military environments; high-g shock study; microelectromechanical devices; munition applications; operational requirements; pressure; rockets; telemetry units; temperature; vibration; Acceleration; Electric shock; Instruments; Land surface temperature; Microelectromechanical devices; Micromechanical devices; Rockets; Sensor phenomena and characterization; Temperature sensors; Weapons;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2003. Proceedings of IEEE
Print_ISBN
0-7803-8133-5
Type
conf
DOI
10.1109/ICSENS.2003.1279042
Filename
1279042
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