DocumentCode :
2704188
Title :
Micromachined infrared sensor arrays on flexible polyimide substrates
Author :
Mahmood, Aamer ; Dayeh, Shadi ; Butler, Donald P. ; Çelik-Butler, Zeynep
Author_Institution :
Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
Volume :
2
fYear :
2003
fDate :
22-24 Oct. 2003
Firstpage :
777
Abstract :
This paper presents work on micromachined infrared detectors on flexible substrates. The detectors are made of semiconducting yttrium-barium-copper-oxide (YBCO) and are built on a 40-50 μm layer of polyimide (PI58578G) that serves as the flexible substrate. Two variants of micromachined infrared detectors have been fabricated The first variant employs a mesa structure in which self-supporting Ti arms hold up the detector pixel. The second variant has a more planar topology with the detector being supported by a layer of silicon nitride. Surface micromachining is used to isolate the detectors from the substrate. After fabrication the polyimide is peeled off the carrier wafer and the devices are packaged and characterized. The 40×40 μm2 microbolometers have responsivities ranging from 7.4×103 V/W to 104 V/W and detectivities ranging from 6.6×105 cm-Hz12//W to 108 cm-Hz12//W. These results are comparable to those obtained for devices made on a rigid silicon substrate. The effect of substrate heating is also investigated and found not to affect the detector performance.
Keywords :
barium compounds; high-temperature superconductors; infrared detectors; micromachining; microsensors; polymer films; superconducting photodetectors; yttrium compounds; 40 to 50 micron; SiN; YBaCuO; YBaCuO detectors; carrier wafer; characterized; flexible polyimide substrates; mesa structure; microbolometers; micromachined infrared sensor arrays; packaged; planar topology; self supporting Ti arms; Arm; Infrared detectors; Infrared sensors; Polyimides; Semiconductivity; Sensor arrays; Silicon; Substrates; Topology; Yttrium barium copper oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2003. Proceedings of IEEE
Print_ISBN :
0-7803-8133-5
Type :
conf
DOI :
10.1109/ICSENS.2003.1279047
Filename :
1279047
Link To Document :
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