Title :
Thermal and electrical characterization of the metal ball grid array (MBGA)
Author :
Solomon, Dawit ; Hoffman, Paul ; Brathwaite, George ; Robinson, Peter ; Madelung, Thomas
Author_Institution :
Olin Interconnect Technol., Manteca, CA, USA
Abstract :
The Ball Grid Array (BGA) package is becoming an attractive alternative to high lead count packaging technology due to its improved I/O density and better thermal and electrical performance. In this paper, thermal and electrical performance analysis of the Metal Ball Grid Array (MBGATM* package) is presented. Results of measurements, two and three dimensional field solutions and finite element calculations are shown
Keywords :
finite element analysis; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; MBGA; electrical performance; finite element calculations; metal ball grid array; packaging technology; thermal performance; three dimensional field solutions; two dimensional field solutions; Circuits; Conductors; Crosstalk; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Fabrication; Impedance; System performance; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517816
