Title :
Polymer/metal composite for interconnection technology
Author :
Saraf, R.F. ; Roldan, Juan ; Jagannathan, R. ; Sambucetti, C. ; Marino, J. ; Jahnes, C.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
In this paper, we report on the the rheological, electrical and mechanical properties of paste which is composed of a thermoplastic polymer, solvent and silver particles, and the resulting polymer/metal composite (PMC) which forms after the solvent from the paste has dried. We will refer to the two states as paste and PMC. The paste properties indicate the applicability of the material for fine feature size interconnects such as required for flip-chip-attach. The adhesive and electrical properties of PMC demonstrates that this material will be suitable as an interconnect media in high performance applications. Furthermore, the system chosen is reworkable and the bonding process is volatile-free (i.e. the solvent may be completely removed prior to the bonding step)
Keywords :
adhesion; filled polymers; flip-chip devices; Ag; adhesive properties; bonding; electrical properties; flip-chip-attach; interconnection technology; mechanical properties; paste; polymer/metal composite; rheological properties; silver particles; thermoplastic polymer; Bonding; Costs; Elasticity; Force measurement; Heating; Integrated circuit interconnections; Packaging; Polymers; Solvents; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517820