DocumentCode :
2704374
Title :
Micro cantilever probe array with integration of electro-thermal nano tip and piezoresistive sensor
Author :
Yang, Zunxian ; Li, Xinxin ; Wang, Yuelin ; Liu, Min ; Haifei Bao ; Cheng, Baoluo
Author_Institution :
Shanghai Inst. of Microsystem & Inf. Technol., Chinese Acad. of Sci., Shanghai, China
Volume :
2
fYear :
2003
fDate :
22-24 Oct. 2003
Firstpage :
830
Abstract :
A micro cantilever-lip silicon probe-array with integrated electro-thermal nano-lip and piezoresistive sensor has been presented for NEMS high-density data storage. Such a 1×10 probe-array is designed after the working principle studied. Both analysis and FEM simulation are used for modeling and designing with their results agreeing well, with a tolerance of only 5%. The devices are fabricated by using silicon bulk micromachining technology. The relationship between the resistance of the heater and the temperature of the tip is experimentally obtained and fitted with second order polynomial function. With the fitted results, the pulse-heating property of the devices is characterized. The tested results are in agreement with the simulation. Under pulsed 4V power supply and 3 μs heating period, the tip can be heated to 463.15 K. Near 100 KHz writing rate can be realized, as 6.2 μs is needed for cooling the heating resistor. The sensitivity of piezoresistivity is 5.4×10-4 under the contact force of 2×10-7 N, which is sufficient to reading the data pitch on PMMA media.
Keywords :
finite element analysis; micromechanical devices; microsensors; nanostructured materials; piezoresistive devices; 3 mus; 4 V; 463.15 K; 6.2 mus; FEM simulation; NEMS high-density data storage; PMMA media; Si; Si bulk micromachining technology; data pitch; designing; electro-thermal nano tip; micro cantilever probe array; modeling; piezoresistive sensor; pulse-heating property; second order polynomial function; Analytical models; Heating; Memory; Micromachining; Nanoelectromechanical systems; Piezoresistance; Probes; Pulsed power supplies; Sensor arrays; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2003. Proceedings of IEEE
Print_ISBN :
0-7803-8133-5
Type :
conf
DOI :
10.1109/ICSENS.2003.1279059
Filename :
1279059
Link To Document :
بازگشت