Design of experimental liquid heat sink for high power electronic

Author

Sprlak, Roman ; OplusÌŒtil, Josef ; Kalvar, Daniel ; Chlebis, Petr

Author_Institution

Dept. of Electron., VSB - Tech. Univ. of Ostrava, Ostrava, Czech Republic

fYear

2014

fDate

10-12 May 2014

Firstpage

392

Lastpage

396

Abstract

This article deals with issue of fluid heat sinks for power electronics. In the introduction there are listed different kinds of heat sinks depending on the complexity of heat sink structure. From this split the group of fluid heat sinks is selected. Chapter of cooling media is based on this chapter. The proposal of special liquid heat sink has been implemented from previous chapters. This heat sink is designed to create turbulent flow of fluid in cooling duct. The thermal simulations are subsequently carried out in this heat sink. Individual simulations are conducted for constant power loss. The simulation of one part of the heat sink is carried out and the whole simulation of heat sink with 3 capacity modules consisting of six IGBT transistors is conducted. Further the simulations of currently accessible fluid heat sinks WP16 and KL494 are provided. All results of simulations are shown in tables.

Keywords

design of experiments; heat sinks; power electronics; constant power loss; cooling duct; fluid heat sinks; high power electronic; liquid heat sink; Corrosion; Fluids; Heat sinks; Heating; Insulated gate bipolar transistors; Media; IGBT module; cooling medium; experimental designe; frequency converter; heat sink; thermal field;

fLanguage

English

Publisher

ieee

Conference_Titel

Environment and Electrical Engineering (EEEIC), 2014 14th International Conference on

Conference_Location

Krakow

Print_ISBN

978-1-4799-4661-7

Type

conf

DOI

10.1109/EEEIC.2014.6835900

Filename

6835900