Title :
Resistance to soldering heat by plastic SMD devices
Author :
Williams, Charles ; Green, Gloria
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The purpose of this study is to study the effect of longer times and more cycles at wave solder temperatures on the reliability of SOIC packages. The contribution of two different mold compounds is also evaluated. For comparison purposes, vapor phase soldering and convection furnace reflow set-ups were also included even though neither condition is as rigorous as immersion in molten solder
Keywords :
integrated circuit packaging; integrated circuit reliability; plastic packaging; printed circuit manufacture; surface mount technology; wave soldering; SOIC packages; immersion; mold compounds; molten solder; plastic SMD devices; reliability; soldering heat; wave solder temperatures; Heat transfer; Manufacturing processes; Materials testing; Petroleum; Plastics; Resistance heating; Semiconductor device packaging; Soldering; Surface resistance; Temperature sensors;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517848
