DocumentCode
2704890
Title
Resistance to soldering heat by plastic SMD devices
Author
Williams, Charles ; Green, Gloria
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1995
fDate
21-24 May 1995
Firstpage
1234
Lastpage
1239
Abstract
The purpose of this study is to study the effect of longer times and more cycles at wave solder temperatures on the reliability of SOIC packages. The contribution of two different mold compounds is also evaluated. For comparison purposes, vapor phase soldering and convection furnace reflow set-ups were also included even though neither condition is as rigorous as immersion in molten solder
Keywords
integrated circuit packaging; integrated circuit reliability; plastic packaging; printed circuit manufacture; surface mount technology; wave soldering; SOIC packages; immersion; mold compounds; molten solder; plastic SMD devices; reliability; soldering heat; wave solder temperatures; Heat transfer; Manufacturing processes; Materials testing; Petroleum; Plastics; Resistance heating; Semiconductor device packaging; Soldering; Surface resistance; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.517848
Filename
517848
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