• DocumentCode
    2704987
  • Title

    Optical performance of low-cost self-aligned MCM-D based optical data links

  • Author

    Dautartas, M.F. ; Benzoni, A.M. ; Broutin, S.L. ; Coucoulas, A. ; Moser, D.T. ; Wong, Y.-H. ; Wong, Y.M.

  • Author_Institution
    Solid State Technol. Centre, AT&T Bell Labs., Breinigsville, PA, USA
  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    1254
  • Lastpage
    1262
  • Abstract
    We discuss the details of the design and performance of the optics proposed for a MCM-D based low-cost multi-mode optical data link. The optical system is completely self-aligned taking advantage of flip-chip bonding, solder-bump self-alignment, mechanical self-alignment using silicon micromachining, and precision plastic components. Preliminary results demonstrate that the integral-lens design of the optoelectronic device significantly effects the coupling efficiency and the requisite tolerances of the components that comprise the coupling optics. We show that coupling efficiencies of 70% or better are readily achievable with piece parts made using standard practices. These coupling efficiencies compare favorably with those in actively-aligned optical subassemblies used in current optical data link products
  • Keywords
    flip-chip devices; multichip modules; optical fibre couplers; optical fibres; optical transmitters; tolerance analysis; coupling efficiency; flip-chip bonding; integral-lens design; mechanical self-alignment; micromachining; multi-mode optical data link; piece part tolerance; precision plastic components; self-aligned MCM-D; self-aligned optical system; solder-bump self-alignment; Bonding; Consumer electronics; Costs; Lenses; Light emitting diodes; Optical coupling; Optical design; Optical devices; Optical receivers; Optical transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.517852
  • Filename
    517852