• DocumentCode
    2705080
  • Title

    Biocompatible assembling and packaging technology demonstrated by the integration of a micro sensor on a micro blood pump

  • Author

    Spanier, G. ; Eberhard, W. ; Ahrend, D. ; Oprea, M. ; Zippmann, V. ; Legewie, F. ; Mokwa, W. ; Kuck, H.

  • Author_Institution
    Inst. of Mater. in Electr. Eng. I, Aachen Univ., Germany
  • Volume
    2
  • fYear
    2003
  • fDate
    22-24 Oct. 2003
  • Firstpage
    991
  • Abstract
    Medical implants are all ideal example of the growing application of microsystems and a convincing proof for their high future potential. The use of implants in human bodies has high demands on safety and biocompatibility on the system. The downsizing of well known systems such as pacemakers, comes to an extent where rigid housings are not possible any more. In addition the systems have become more and more flexible in order to enter new fields of applications. Therefore the assembly and packaging of implantable micro-systems plays a mayor role in the useability of new implants. As an example for the integration of a microsystem in a medical implant, a micro bloodpump with a micro pressure sensor was developed. For the first time MID (moulded interconnected device) technology was applied in a medical device. MID technology plays the key role in the multifunctional use of the components: it functions as sensor mount, electric conductor and pump housing. In addition to that the whole system should be biocompatible even if partial damage to the coating occurs.
  • Keywords
    biomedical materials; blood flow measurement; microfluidics; micropumps; microsensors; packaging; pressure sensors; prosthetics; biocompatibility; biocompatible assembling technology; biocompatible packaging technology; downsizing; medical implants; micro blood pump; micro pressure sensor; microsensor integration; moulded interconnected device; pacemakers; safety; Assembly; Biosensors; Blood; Coatings; Conductors; Humans; Implants; Pacemakers; Packaging; Safety;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2003. Proceedings of IEEE
  • Print_ISBN
    0-7803-8133-5
  • Type

    conf

  • DOI
    10.1109/ICSENS.2003.1279091
  • Filename
    1279091