DocumentCode
2705263
Title
Physical defect modeling for fault insertion in system reliability test
Author
Zhang, Zhaobo ; Wang, Zhanglei ; Gu, Xinli ; Chakrabarty, Krishnendu
Author_Institution
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
10
Abstract
Hardware fault-insertion test (FIT) is a promising method for system reliability test and diagnosis coverage measurement. It improves the speed of releasing a quality diagnostic program before manufacturing and provides feedbacks of fault tolerance of a very complicated large system. Certain level insufficient fault tolerance can be fixed in the current system but others may require ASIC or overall system architectural modifications. The FIT is achieved by introducing an artificial fault (defect modeling) at the pin level of a module to mimic any physical defect behavior within the module, such as SEU (single event upset) or escaped delay defect. We present a hardware architectural solution for pin fault insertion. We also present a simulation framework and optimization techniques for a subset of module pin selection for FIT, such that desired coverage are obtained under the constraints of limited FIT pins due to the costs of the associated implementation. Experimental results are presented for selected ISCAS and OpenCore benchmarks, as well as for an industrial circuit.
Keywords
application specific integrated circuits; fault diagnosis; integrated circuit reliability; integrated circuit testing; modelling; optimisation; simulation; ASIC; diagnosis coverage measurement; hardware architectural solution; hardware fault-insertion test; optimization; physical defect modeling; pin fault insertion; quality diagnostic program; simulation; system reliability test; Application specific integrated circuits; Circuit faults; Fault diagnosis; Fault tolerant systems; Feedback; Hardware; Manufacturing; Reliability; Single event upset; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355715
Filename
5355715
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