• DocumentCode
    2705263
  • Title

    Physical defect modeling for fault insertion in system reliability test

  • Author

    Zhang, Zhaobo ; Wang, Zhanglei ; Gu, Xinli ; Chakrabarty, Krishnendu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
  • fYear
    2009
  • fDate
    1-6 Nov. 2009
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Hardware fault-insertion test (FIT) is a promising method for system reliability test and diagnosis coverage measurement. It improves the speed of releasing a quality diagnostic program before manufacturing and provides feedbacks of fault tolerance of a very complicated large system. Certain level insufficient fault tolerance can be fixed in the current system but others may require ASIC or overall system architectural modifications. The FIT is achieved by introducing an artificial fault (defect modeling) at the pin level of a module to mimic any physical defect behavior within the module, such as SEU (single event upset) or escaped delay defect. We present a hardware architectural solution for pin fault insertion. We also present a simulation framework and optimization techniques for a subset of module pin selection for FIT, such that desired coverage are obtained under the constraints of limited FIT pins due to the costs of the associated implementation. Experimental results are presented for selected ISCAS and OpenCore benchmarks, as well as for an industrial circuit.
  • Keywords
    application specific integrated circuits; fault diagnosis; integrated circuit reliability; integrated circuit testing; modelling; optimisation; simulation; ASIC; diagnosis coverage measurement; hardware architectural solution; hardware fault-insertion test; optimization; physical defect modeling; pin fault insertion; quality diagnostic program; simulation; system reliability test; Application specific integrated circuits; Circuit faults; Fault diagnosis; Fault tolerant systems; Feedback; Hardware; Manufacturing; Reliability; Single event upset; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2009. ITC 2009. International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4868-5
  • Electronic_ISBN
    978-1-4244-4867-8
  • Type

    conf

  • DOI
    10.1109/TEST.2009.5355715
  • Filename
    5355715