• DocumentCode
    2705310
  • Title

    PCR array on chip - thermal characterization

  • Author

    Iordanov, Ventzeslav P. ; Bastemeijer, Jeroen ; Bossche, Andre ; Sarro, Pasqualina M. ; Malátek, Michal ; Young, Ian T. ; Van Dedem, Gijs W K ; Vellekoop, Michiel J.

  • Author_Institution
    Electron. Instrum. Lab., Delft Univ. of Technol., Netherlands
  • Volume
    2
  • fYear
    2003
  • fDate
    22-24 Oct. 2003
  • Firstpage
    1045
  • Abstract
    This paper presents thermal analysis simulation and verification of a 50-nanoliter-reactor PCR (Polymerase Chain Reaction) well for application in silicon arrays, allowing 5×5 chamber matrix to be fitted on a 1cm2 square. Every reactor cell is equipped with an integrated heater, temperature sensor and a photodetector. Each well forms a separate unit independently controlled and thermally insulated from the rest. Through micromachining the thermal capacity of each chamber is minimized, enabling rapid (8 - 10 cycles per minute) PCR cycling. To characterize the thermal behavior, an equivalent lumped element electrical circuit was defined and the results were compared to those obtained by Finite Element Method (FEM) analysis with CoventorWare™. The proposed structure was implemented on a silicon substrate using a standard CMOS process and post-processing. Experiments were performed for verification of the model. Analysis shows that a temperature of about 95°C can be reached (starting from 55°C) by applying 1.5 W of electrical power in the integrated heater over a period of less than 2.5 seconds. The cooling (not active - self cooling) of the device is done in about 1.5 second.
  • Keywords
    CMOS integrated circuits; DNA; biosensors; finite element analysis; molecular biophysics; photodetectors; temperature sensors; thermal analysis; 1.5 W; 1.5 sec; 2.5 sec; 55 degC; 95 degC; CoventorWare; Finite Element Method; PCR array on chip; equivalent lumped element electrical circuit; integrated heater; micromachining; photodetector; polymerase chain reaction; post-processing; standard CMOS process; temperature sensor; thermal capacity; thermal characterization; Analytical models; Cooling; Inductors; Insulation; Micromachining; Photodetectors; Polymers; Rapid thermal processing; Silicon; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2003. Proceedings of IEEE
  • Print_ISBN
    0-7803-8133-5
  • Type

    conf

  • DOI
    10.1109/ICSENS.2003.1279102
  • Filename
    1279102