• DocumentCode
    2705561
  • Title

    EMI pre-measuring system on supply line conducted interference based on spectrum analyzer

  • Author

    Tang, Zhi-jun ; Zhang, Xiao-dong ; Yue, Ling-ling ; Wang, Lin

  • Author_Institution
    Coll. of Electr. Eng., Beijing Jiaotong Univ., Beijing, China
  • fYear
    2009
  • fDate
    27-29 Oct. 2009
  • Firstpage
    826
  • Lastpage
    830
  • Abstract
    With the implementation of China Compulsive Certification (CCC), more and more manufacturers realize that they must improve their product quality on EMC. In this paper, one system of electromagnetic interference (EMI) pre-measuring is developed to meet the product designer´s demand for EMI diagnoses. The system is applied to measure the unsymmetric interferential signal of supply line quantitatively based on the spectrum analyzer, line impedance stabilization network (LISN) and automatic test system. The structure of the test system is described firstly. Then the circuit diagram of V-LISN for the unsymmetric interferential signal test is showed. A designing method of automatic test system based on LabVIEW is commented in detailed. At last, a test is carried out to demonstrate the system is rational and applied.
  • Keywords
    automatic test equipment; electromagnetic compatibility; electromagnetic interference; spectral analysers; virtual instrumentation; China Compulsive Certification; EMI premeasuring system; LabVIEW; automatic test system; electromagnetic interference premeasuring; line impedance stabilization network; product quality; spectrum analyzer; supply line conducted interference; Automatic testing; Certification; Circuit testing; Electromagnetic compatibility; Electromagnetic interference; Impedance measurement; Manufacturing; Product design; Spectral analysis; System testing; EMI Pre-Measuring; LabVIEW; V-LISN; unsymmetric interference;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4076-4
  • Type

    conf

  • DOI
    10.1109/MAPE.2009.5355729
  • Filename
    5355729