• DocumentCode
    2705644
  • Title

    Fast modelling of microwave circuits exploiting space mapping technology

  • Author

    Cao, Cheng ; Dai, Fei

  • Author_Institution
    EMC Lab., Beijing Univ. of Aeronaut. & Astronaut., Beijing, China
  • fYear
    2009
  • fDate
    27-29 Oct. 2009
  • Firstpage
    385
  • Lastpage
    388
  • Abstract
    In this paper, an efficient space mapping based surrogate modelling technique for microwave circuit is proposed. This technique ensures us to build microwave models of high accuracy and fast speed exploiting quite small amount of 3D electromagnet simulation data. This method proposed in this paper utilizes a nearest neighbour weighted methodology to build the surrogate model. The nearest neighbour technology ensures that each sample results in improved mapping between the coarse and the fine model parameters needed to execute the SM modelling. Standard space mapping modelling is enhanced by the nearest neighbour technology: (1) utilize the closest k points of the given points to gain the local information, (2)different weighted technology mimic the smooth of the parameter space. A good fitness between the coarse model response and the fine model response is demonstrated through a example of microstrip bandpass filter.
  • Keywords
    band-pass filters; microstrip filters; microwave circuits; 3D electromagnet simulation; component space mapping; microstrip bandpass filter; microwave circuit; nearest neighbour weighted methodology; space mapping technology; surrogate modelling technique; Band pass filters; Circuit simulation; Electromagnetic modeling; Electromagnets; Microstrip filters; Microwave circuits; Microwave technology; Microwave theory and techniques; Samarium; Space technology; component; electromagnetic (EM) simulation; filter design; k nearest neighbour (K-NN); microwave circuits; parameter extraction (PE); space mapping(SM); surrogate models;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4076-4
  • Type

    conf

  • DOI
    10.1109/MAPE.2009.5355732
  • Filename
    5355732