DocumentCode
2705968
Title
Test economics for homogeneous manycore systems
Author
Huang, Lin ; Xu, Qiang
Author_Institution
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Hong Kong, China
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
10
Abstract
Homogeneous manycore systems that contain a large number of structurally identical cores are emerging for tera-scale computation. To ensure the required quality and reliability of such complex integrated circuits before supplying them to final users, extensive manufacturing tests need to be conducted and the associated test cost can account for a great share of the total production cost. By introducing spare cores on-chip, the burn-in test time can be shortened and the defect coverage requirements for core tests can be also relaxed, without sacrificing quality of the shipped products. The above test cost reduction is likely to exceed/compensate the manufacturing cost of the extra cores, thus reducing the total production cost of manycore systems. We develop novel analytical models that capture the above tradeoff in this paper and we verify the effectiveness of the proposed test economics model for hypothetical manycore systems with various configurations.
Keywords
design for testability; integrated circuit reliability; integrated circuit testing; microprocessor chips; burn-in test time; complex integrated circuits; defect coverage requirements; homogeneous manycore systems; integrated circuit quality; integrated circuit reliability; manufacturing tests; spare cores on-chip; structurally identical cores; tera-scale computation; test cost reduction; test economics; Automatic testing; Circuit testing; Costs; Integrated circuit manufacture; Integrated circuit reliability; Integrated circuit technology; Integrated circuit testing; Manufacturing processes; Production; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355748
Filename
5355748
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