DocumentCode :
2706107
Title :
Dielectric breakdown and current conduction of oxide/nitride/oxide multi-layer structures
Author :
Kobayashi, Kaoru ; Miyatake, H. ; Mitsuhashi, J. ; Hirayama, Motoko ; Higaki, T. ; Abe, H.
fYear :
1990
fDate :
4-7 June 1990
Firstpage :
119
Lastpage :
120
Abstract :
Experimental results prove that the dielectric breakdown and the current conduction of the oxide/nitride/oxide (ONO) structures indicate symmetric characteristics related to the gate bias polarity. This is due to the thick bottom and top oxides. The conduction current in the ONO structures is remarkably reduced as the bottom or top oxide thickness becomes thicker than 3 nm. The time-dependent dielectric breakdown increases with increasing bottom-oxide thickness under negative gate bias and with increasing top-oxide thickness under positive gate bias. These two phenomena are due to the change of the oxide barrier for a hole. 3 nm is the transition thickness for the current conduction and breakdown mechanisms. The dielectric breakdown and the current conduction of the ONO structures show symmetric characteristics related to the gate bias polarity due to the bottom and top oxides
Keywords :
electric breakdown of solids; electronic conduction in insulating thin films; insulating thin films; metal-insulator-semiconductor structures; MIS structures; ONO structures; current conduction; dielectric breakdown; gate bias polarity; negative gate bias; oxide/nitride/oxide multi-layer structures; positive gate bias; symmetric characteristics; transition thickness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1990. Digest of Technical Papers.1990 Symposium on
Conference_Location :
Honolulu, Hawaii, USA
Type :
conf
DOI :
10.1109/VLSIT.1990.111037
Filename :
5727497
Link To Document :
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