• DocumentCode
    2706107
  • Title

    Dielectric breakdown and current conduction of oxide/nitride/oxide multi-layer structures

  • Author

    Kobayashi, Kaoru ; Miyatake, H. ; Mitsuhashi, J. ; Hirayama, Motoko ; Higaki, T. ; Abe, H.

  • fYear
    1990
  • fDate
    4-7 June 1990
  • Firstpage
    119
  • Lastpage
    120
  • Abstract
    Experimental results prove that the dielectric breakdown and the current conduction of the oxide/nitride/oxide (ONO) structures indicate symmetric characteristics related to the gate bias polarity. This is due to the thick bottom and top oxides. The conduction current in the ONO structures is remarkably reduced as the bottom or top oxide thickness becomes thicker than 3 nm. The time-dependent dielectric breakdown increases with increasing bottom-oxide thickness under negative gate bias and with increasing top-oxide thickness under positive gate bias. These two phenomena are due to the change of the oxide barrier for a hole. 3 nm is the transition thickness for the current conduction and breakdown mechanisms. The dielectric breakdown and the current conduction of the ONO structures show symmetric characteristics related to the gate bias polarity due to the bottom and top oxides
  • Keywords
    electric breakdown of solids; electronic conduction in insulating thin films; insulating thin films; metal-insulator-semiconductor structures; MIS structures; ONO structures; current conduction; dielectric breakdown; gate bias polarity; negative gate bias; oxide/nitride/oxide multi-layer structures; positive gate bias; symmetric characteristics; transition thickness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1990. Digest of Technical Papers.1990 Symposium on
  • Conference_Location
    Honolulu, Hawaii, USA
  • Type

    conf

  • DOI
    10.1109/VLSIT.1990.111037
  • Filename
    5727497