DocumentCode
2706149
Title
Application of low temperature plasma modification explore the technical processing of nano HMX
Author
Xiaode Guo ; Binbin Dong ; Fengsheng Li ; Zhixiang Wang ; Fei Wu
Author_Institution
Nat. Special Superfine Powder Eng. Res. Center of China, Nanjing Univ. of Sci. & Technol., Nanjing, China
fYear
2015
fDate
23-25 April 2015
Firstpage
38
Lastpage
41
Abstract
Firstly, use the low temperature plasma equipment to process nano HMX. Then, use The dispersion and the morphology of nano HMX were characterized by Wet Zetasizer Nano and scanning electron microscope (SEM). Use fourier transform infrared spectrometer (FT-IY) and X-ray powder diffraction X-ray diffraction (XRD) and X-ray photoelectron spectrometer (XPS) to analyze its main composition, structure and surface element valence state changes. Finally, differential scanning calorimetry-thermogravimetric analysis (TG-DSC) to analyze the nanometer HMX thermal decomposition characteristics. Use the impact sensitivity test instrument to test its impact sensitivity. The result shows that treated nano HMX reunion reduce dispersion becomes better, treated nano HMX lower impact sensitivity of 8.1%, whitch improved its safety.
Keywords
Fourier transform infrared spectra; X-ray diffraction; X-ray photoelectron spectra; differential scanning calorimetry; explosives; nanostructured materials; plasma materials processing; powder technology; scanning electron microscopy; Fourier transform infrared spectrometer; X-ray photoelectron spectrometer; X-ray powder diffraction; differential scanning calorimetry-thermogravimetric analysis; low-temperature dispersion modification; low-temperature plasma equipment; nanoHMX morphology; nanometer HMX thermal decomposition characteristics; scanning electron microscope; surface element valence state; Dispersion; Nanoparticles; Plasma temperature; Sensitivity; Temperature; Thermal decomposition; dispersion; impact sensitivity; low temperature plasma; nano HMX; the thermal decomposition characteristics;
fLanguage
English
Publisher
ieee
Conference_Titel
Defence Technology (ACDT), 2015 Asian Conference on
Conference_Location
Hua Hin
Print_ISBN
978-1-4799-8166-3
Type
conf
DOI
10.1109/ACDT.2015.7111580
Filename
7111580
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