DocumentCode :
2706775
Title :
Characterization of multiple coupled interconnection lines from time domain measurement
Author :
Tripathi, V.K. ; Rettig, J.B. ; Hayden, L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fYear :
1990
fDate :
12-13 Jun 1990
Firstpage :
416
Lastpage :
418
Abstract :
Measurement techniques used to characterize the uniformly and nonuniformly coupled interconnects in high-speed single-layered and multilayered structures are reported. For an N-line structure, time-domain reflectometer (TDR) measurements can be used to extract all the normal mode parameters of the coupled interconnect system. These include N×(N+1)/2 independent characteristic impedance matrix elements, N eigenvalues representing the normal mode velocities, and a voltage or current eigenvector matrix. The basic excitation response model is shown. For uniformly coupled lines N sets of linearly independent measurements can be made where step waveforms are applied at specified nodes and the response is measured at all the nodes. With a multichannel TDR system it is possible to excite more than one line at a time, e.g. the common and differential modes of a pair of coupled lines. The characteristic impedance matrix elements are evaluated in terms of the generalized reflection coefficient or the scattering matrix elements at the input end in terms of N linearly independent excitations
Keywords :
S-matrix theory; eigenvalues and eigenfunctions; electric impedance; integrated circuit testing; metallisation; time-domain reflectometry; characteristic impedance matrix; current eigenvector matrix; eigenvalues; excitation response model; high-speed; mode velocities; multichannel TDR system; multilayered structures; multiple coupled interconnection lines; reflection coefficient; scattering matrix; single-layered; step waveforms; time domain measurement; time-domain reflectometer; voltage eigenvector matrix; Capacitance; Couplings; Eigenvalues and eigenfunctions; Frequency domain analysis; Frequency measurement; Impedance; Measurement techniques; Reflection; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location :
Santa Clara, CA
Type :
conf
DOI :
10.1109/VMIC.1990.127917
Filename :
127917
Link To Document :
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