Comparative statistical studies of aging models for polypropylene films

Author

Stokes, A.N. ; Laghari, J.R. ; Sarjeant, W.J.

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, Buffalo, NY, USA

fYear

1994

fDate

5-8 Jun 1994

Firstpage

332

Lastpage

335

Abstract

Accelerated aging experiments are conducted to investigate the effects of continuous thermal aging on the DC electrical lifetimes of capacitor grade biaxially-oriented isotactic polypropylene film. Statistical analysis of the lifetime data includes assessment of possible underlying parametric distributions such as the 2-parameter Weibull (weakest link time-to-failure) and the lognormal (cumulative damage time-to-failure) distributions via graphical, analytical and residual analysis. Parametric and nonparametric methods are used. The mean life is fitted into semi-empirical (quasi-theoretical) models available in the literature to describe the behavior of the film within the stress range tested. Multiple-linear regression is used to compute parameters of the life-stress models. A thorough regression analysis including goodness of fit measures such as (χ² and R²) is carried out using the SAS package

Keywords

Weibull distribution; ageing; failure analysis; insulating thin films; insulation testing; life testing; log normal distribution; organic insulating materials; polymer films; statistical analysis; thermal stresses; 2-parameter Weibull distribution; DC electrical lifetime; SAS package; accelerated aging experiments; aging models; biaxially-oriented isotactic film; capacitor grade film; continuous thermal aging; life-stress models; lifetime data; lognormal distribution; multiple-linear regression; polypropylene films; regression analysis; residual analysis; semi-empirical models; statistical analysis; statistical study; Accelerated aging; Capacitors; Conductive films; Life testing; Packaging; Regression analysis; Residual stresses; Statistical analysis; Synthetic aperture sonar; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on

Conference_Location

Pittsburgh, PA

ISSN

1089-084X

Print_ISBN

0-7803-1942-7

Type

conf

DOI

10.1109/ELINSL.1994.401431

Filename

401431