Optimized Substrate Integrated Waveguide Bends for Ultra-High Speed Digital Interconnects

Author

Simpson, Jamesina J. ; Taflove, Allen ; Mix, Jason A. ; Heck, Howard

Author_Institution

Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL

fYear

2006

fDate

9-14 July 2006

Firstpage

4519

Lastpage

4522

Abstract

This paper reports on an experimental and computational study of substrate integrated waveguides (SIW) optimized for use as ultrahigh-speed bandpass wireless digital interconnects. Specifically, a straight and 60deg-bend SIW optimized for narrow transverse dimensions, low loss, low crosstalk, and maximum bandwidth with no multimoding is reported in this paper. Because existing circuit-board technology permits dimensional reductions of SIWs by a factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/sec appear feasible. These data rates meet or exceed those expected eventually for proposed optical interconnects without requiring the development of a suite of essentially revolutionary silicon photonic technologies

Keywords

crosstalk; digital integrated circuits; integrated circuit interconnections; very high speed integrated circuits; waveguide discontinuities; 200 Gbit/s; circuit-board technology; crosstalk; substrate integrated waveguide bends; ultrahigh-speed bandpass wireless digital interconnects; Bandwidth; Circuit testing; Electromagnetic waveguides; Integrated circuit interconnections; Integrated circuit technology; Optical waveguides; Periodic structures; Printed circuits; Silicon; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium 2006, IEEE

Conference_Location

Albuquerque, NM

Print_ISBN

1-4244-0123-2

Type

conf

DOI

10.1109/APS.2006.1711641

Filename

1711641