DocumentCode
2707823
Title
Test chip experiments at stanford CRC
Author
Al-Yamani, A. ; Chang, Jonathan ; Franco, Piero ; Li, James ; Ma, Siyad ; Mitra, Subhasish ; Park, Intaik ; Tseng, Chao-Wen ; Volkerink, Erik
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
1
Abstract
The idea of the test chip experiments started in ITC 1991 (McCluskey and Tseng, 2000). We wanted to get actual tester data that would answer some questions about manufacturing test of digital ICs. The objective was to find out the relative effectiveness of different test techniques, such as stuck fault tests, delay tests, IDDq, etc. The test chips are Murphy, ELF35, ELF18, and ELF13.
Keywords
digital integrated circuits; fault diagnosis; integrated circuit manufacture; integrated circuit testing; logic testing; ELF13; ELF18; ELF35; IDDq; Murphy; delay test; digital IC manufacturing test; stuck fault test; test chip experiment; test technique; Chaos; Circuit faults; Circuit testing; Cyclic redundancy check; Graphics; Large scale integration; Logic design; Logic testing; Manufacturing; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355839
Filename
5355839
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