Abstract :
The following topics are dealt with: microwave photonics; RF MEMS tunable components; frequency domain techniques; low noise components and receivers; microwave filters and diplexers; time domain modeling; antenna technologies; magnetic resonance imaging; MEMS switch and packaging technology; wireless applications; terahertz integrated circuits; acoustic filters; signal generation for system applications; integrated coaxial and metamaterial transmission lines; beam-forming arrays; nonlinear measurement-based modeling; multi-GHz ICs for communication and instrumentation; multiband and broadband planar filters; ferrite and ferroelectric devices; low phase noise oscillators; electromagnetic bandgap; phased and retrodirective arrays; nonlinear circuit analysis and system simulation; miniature filters and multiplexers; GaN for microwave PA applications; wireless communication; physical nonlinear device modeling; power amplifier devices; tunable and metamaterial filters; organic millimeterwave packaging; innovative millimeter/terahertz circuit elements; wideband communication and radar systems; microwave CAD with neural networks and fuzzy logic; guided-wave and periodic structures; microwave and millimeter-wave transceiver and frequency conversion MMICs; couplers and baluns; sensor systems; materials measurement; wideband amplifiers and control circuits; compact dividers and couplers; biological effects and medical applications; linear modeling techniques
Keywords :
MIMIC; MMIC; acoustic filters; antenna phased arrays; baluns; coaxial cables; electronics packaging; ferrite devices; ferroelectric devices; frequency-domain analysis; magnetic resonance imaging; metamaterials; micromechanical devices; microwave antennas; microwave filters; microwave measurement; microwave mixers; microwave oscillators; microwave photonics; microwave power amplifiers; microwave receivers; multiplexing equipment; nonlinear network analysis; photonic band gap; power dividers; time-domain analysis; transceivers; waveguide couplers; MEMS packaging technology; MEMS switch; RF MEMS tunable components; acoustic filters; antenna technologies; baluns; beam-forming arrays; couplers; electromagnetic bandgap; ferrite devices; ferroelectric devices; frequency conversion MMIC; frequency domain techniques; fuzzy logic; guided-wave structures; integrated coaxial transmission lines; low noise components; low noise receivers; low phase noise oscillators; magnetic resonance imaging; metamaterial filters; metamaterial transmission lines; microwave CAD; microwave diplexers; microwave filters; microwave photonics; microwave power amplifiers; microwave transceiver; millimeter-wave transceiver; neural networks; nonlinear circuit analysis; organic millimeterwave packaging; periodic structures; phased arrays; planar filters; radar systems; retrodirective arrays; sensor systems; signal generation; terahertz integrated circuits; time domain modeling; wideband communication systems; wireless communication;
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9541-7
DOI :
10.1109/MWSYM.2006.249861
