Title :
Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS
Author :
Yuxiang, Yuan ; Yoshida, Yoichi ; Kuroda, Tadahiro
Author_Institution :
Keio Univ., Kanagawa
Abstract :
This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-mum CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700 mum times 700 mum on-chip inductors, the test chip achieves 10% peak efficiency and 36 mW power transmission. Compared with previous published chip-to-chip wireless power transmission systems, the received power is 13 times larger.
Keywords :
CMOS integrated circuits; inductors; power integrated circuits; rectifiers; CMOS process; efficiency 10 percent; high-power rectifier structures; inductive coupling power delivery system; on-chip inductor; power 36 mW; size 0.18 mum; Bonding; CMOS process; Circuit topology; Costs; Coupling circuits; Inductors; Integrated circuit packaging; Power transmission; Rectifiers; System-on-a-chip;
Conference_Titel :
Solid-State Circuits Conference, 2007. ASSCC '07. IEEE Asian
Conference_Location :
Jeju
Print_ISBN :
978-1-4244-1359-1
Electronic_ISBN :
978-1-4244-1360-7
DOI :
10.1109/ASSCC.2007.4425745
