Title :
The effect of bonding sequence on GMR ESD protection
Author :
Zhao, FG ; Tao, Rock ; Tia, Hong
Author_Institution :
SAE Magnectics (HK) Ltd, Dongguan City, China
Abstract :
One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent "metal contact", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA and HSA processes where the "metal contact" cannot be avoided.
Keywords :
assembling; electronic equipment manufacture; electrostatic discharge; giant magnetoresistance; magnetic heads; magnetoresistive devices; protection; ESD protection; GMR ESD protection; GMR head gimbal assembly; GMR head stack assembly; HGA process; HSA process; bonding sequence; direct GMR sensor-metal contact; metal contact; metal contact prevention; Bonding; CD recording; Electrostatic discharge; Gold; Grounding; Magnetic heads; Magnetic recording; Magnetic sensors; Protection; Wire;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-58537-018-5
DOI :
10.1109/EOSESD.2000.890046
