DocumentCode
2708397
Title
SCR-based ESD protection for high bandwidth DRAMs
Author
Kang, Myounggon ; Song, Ki-Whan ; Chung, Hoeju ; Kim, Jinyoung ; Lee, Yeong-Taek ; Kim, Changhyun
Author_Institution
Samsung Electron. Co. Ltd., Hwasung
fYear
2007
fDate
12-14 Nov. 2007
Firstpage
208
Lastpage
211
Abstract
A modified SCR (silicon controlled rectifier) is proposed as an ESD protection for high speed signaling systems. With low voltage triggering (LVT) characteristics and good turn-on uniformity, the proposed SCR scheme accomplishes both goals, high discharging capability and Cin (input capacitance) reduction. The fabricated chips with the new ESD scheme passed the severe package level EOS test conditions such as HBM-5 kV and MM-500 V stress. The input capacitance, Cin, was measured to be 1.5 pF which satisfies the DDR3-1066 specification with enough margin. We have observed in SPICE simulation that the data eye can be enlarged to 277 ps (55.3% of UI) in DDR3 interface at 2 Gbps operation due to the Cin reduction effect.
Keywords
DRAM chips; electrostatic discharge; thyristors; DDR3-1066 specification; SCR-based ESD protection; SPICE simulation; high bandwidth DRAM; input capacitance reduction; low voltage triggering; modified silicon controlled rectifier; severe package level EOS test conditions; Bandwidth; Capacitance; Communication system signaling; Earth Observing System; Electrostatic discharge; Low voltage; Packaging; Protection; Testing; Thyristors; DRAM; ESD; GGNMOS; SCR; high speed; input capacitance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2007. ASSCC '07. IEEE Asian
Conference_Location
Jeju
Print_ISBN
978-1-4244-1359-1
Electronic_ISBN
978-1-4244-1360-7
Type
conf
DOI
10.1109/ASSCC.2007.4425767
Filename
4425767
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