Device charging in shipping packages

Author

Unger, Burt

Author_Institution

Burt Unger Associates, Monmouth Beach, NJ, USA

fYear

2000

fDate

26-28 Sept. 2000

Firstpage

361

Lastpage

367

Abstract

Static charges can develop on devices with movement in shipping packages. During subsequent handling or testing operations, an ESD (electrostatic discharge) can result in device failure. Therefore, the materials used to package semiconductor devices should be selected for their ability to minimize charging and damaging ESDs. Some triboelectric charging test results are shown that suggest that some of these device packages contribute to the failure rate at the assembly facilities.

Keywords

assembling; electrostatic discharge; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated circuit yield; materials handling; static electrification; triboelectricity; ESD; ESD damage; assembly facilities; charging minimization; device charging; device failure; device movement; device packages; electrostatic discharge; failure rate; handling; semiconductor device packages; shipping packages; static charges; testing; triboelectric charging test; Assembly; Capacitance; Charge measurement; Circuit testing; Coatings; Current measurement; Electronic equipment testing; Electrostatic discharge; Protection; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000

Conference_Location

Anaheim, CA, USA

Print_ISBN

1-58537-018-5

Type

conf

DOI

10.1109/EOSESD.2000.890103

Filename

890103