DocumentCode :
2708643
Title :
ESD performance of bridge-resistance pressure diaphragm sensors
Author :
Lei, Kuo-Lung ; Chu, Charles Y. ; Tseng, Justine Y. ; Chiang, Yuh-Min ; Young, Michael
Author_Institution :
Adv. Custom Sensors Inc., Irvine, CA, USA
fYear :
2000
fDate :
26-28 Sept. 2000
Firstpage :
413
Lastpage :
419
Abstract :
The ESD performance of bridge-resistance based pressure diaphragm sensors, including micromachined silicon sensors and high-performance thin film sensors, is evaluated based on sensor span and offset as failure criteria. Different micromachined silicon sensors from different vendors show considerable differences in ESD performance. It is found that sensing element construction and layout contributes significantly to sensor ESD robustness. An incoming qualifying procedure is also developed to further help sensor application companies to screen sensing elements from different vendors. In addition, weak spots in current design are also identified.
Keywords :
bridge circuits; diaphragms; electric resistance; electric sensing devices; electrostatic discharge; elemental semiconductors; failure analysis; micromachining; microsensors; pressure sensors; semiconductor device reliability; silicon; ESD performance; Si; bridge-resistance based pressure diaphragm sensors; bridge-resistance pressure diaphragm sensors; design weaknesses; failure criteria; micromachined silicon sensors; qualifying procedure; sensing element construction; sensing element layout; sensing element screening; sensor ESD robustness; sensor offset; sensor span; thin film sensors; Electrostatic discharge; Mechanical sensors; Piezoresistance; Resistors; Robustness; Semiconductor thin films; Silicon; Stress measurement; Tensile stress; Thin film sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-58537-018-5
Type :
conf
DOI :
10.1109/EOSESD.2000.890110
Filename :
890110
Link To Document :
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