Title :
Implications of 3-D integrated circuits at board test position paper
Author :
Parker, Kenneth P.
Author_Institution :
Agilent Technol., Loveland, CO, USA
Abstract :
Three-dimensional integrated circuits are coming to circuit boards near you. Testing boards with such components offers new, yet familiar challenges. As before, we need to determine if the right device is present, oriented, live, properly aligned and attached to the board with no shorts, opens or attachment quality defects.
Keywords :
integrated circuit testing; printed circuits; quality management; 3D integrated circuits; board test position; circuit boards; quality defects; Automatic optical inspection; Circuit testing; Integrated circuit interconnections; Integrated circuit technology; Integrated circuit testing; Packaging; Paper technology; Space technology; System testing; Three-dimensional integrated circuits;
Conference_Titel :
Test Conference, 2009. ITC 2009. International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4868-5
Electronic_ISBN :
978-1-4244-4867-8
DOI :
10.1109/TEST.2009.5355892
