Title :
Testing of 3D chips: Is there anything new under the sun?
Abstract :
3D chips based on Through-Silicon Vias are hot in the design and processing community. What new test challenges do they bring forward, and how much of the learnings from MCM and SIP testing can be applied in this field?
Keywords :
integrated circuit testing; three-dimensional integrated circuits; 3D chips testing; MCM testing; SIP testing; through-silicon vias; Bandwidth; Cost function; Electronics industry; Logic testing; Power dissipation; Process design; Semiconductor device packaging; Stacking; Sun; Through-silicon vias;
Conference_Titel :
Test Conference, 2009. ITC 2009. International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4868-5
Electronic_ISBN :
978-1-4244-4867-8
DOI :
10.1109/TEST.2009.5355903
