DocumentCode
2709952
Title
Design and implement of BPSK modulator and demodulator based on modern DSP technology
Author
Song, Wenmiao ; Zhang, Jingying ; Yao, Qiongqiong
Author_Institution
Dept. of Electron. & Commun. Eng., North China Electr. Power Univ., Baoding, China
fYear
2009
fDate
27-29 Oct. 2009
Firstpage
1135
Lastpage
1137
Abstract
This paper presents a method to design BPSK modulator and demodulator. The method makes use of modern DSP technology which uses the tool of DSP Builder of American Altera Co. The direct digital synthesis (DSP) principle is briefly presented and used to design orthogonal cosine signal module. In demodulator, we use the low pass FIR filtering IP core to filter high frequency component. The BPSK modem is ultimately implemented on the FPGA device. This design uses MATLAB/Simulink, DSP Builder 7.2, ModelSim 6.1 g and Quartus II 7.2 to simulate and realize directly BPSK modulator and demodulator based on FPGA, using DSP Builder to substitute the VHDL programming, has the organic integration in modeling and hardware implementation on the same work bench. The method can greatly improve the developing efficiency, shorten developing period and reduce costs. The practice has proved the accuracy and validity of the method.
Keywords
FIR filters; digital signal processing chips; digital-analogue conversion; direct digital synthesis; electronic design automation; field programmable gate arrays; modems; phase shift keying; BPSK modem; BPSK modulator-demodulator; DSP Builder 7.2; DSP technology; FPGA device; Matlab Simulink; ModelSim 6.1 g; Quartus II 7.2; direct digital synthesis; low pass FIR filter IP core; orthogonal cosine signal module; Binary phase shift keying; Demodulation; Design methodology; Digital signal processing; Field programmable gate arrays; Finite impulse response filter; Low pass filters; Mathematical model; Signal design; Signal synthesis; BPSK; DDS; DSP Builde; FIR; IP core;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4076-4
Type
conf
DOI
10.1109/MAPE.2009.5355961
Filename
5355961
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