• DocumentCode
    2710030
  • Title

    Design and simulation of a MEMS based dual axis capacitive accelerometer

  • Author

    Jayanetti, V.C. ; Jayathilaka, W.A.D.M. ; Talawatta, K.I. ; Amarasinghe, Y.W.R.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Moratuwa, Katubedda, Sri Lanka
  • fYear
    2015
  • fDate
    7-8 April 2015
  • Firstpage
    194
  • Lastpage
    198
  • Abstract
    Micro Electro Mechanical Systems (MEMS) based multi axis accelerometers are embedded in many modern technological applications. These sensors are widely used in smart electronics, bio-medical uses, automobiles and aeronautics. The work followed herewith is focused on designing of a 2 degree of freedom (D.O.F) MEMS based capacitive accelerometer which can be used with such vibration detection modules. The 2mm × 2mm × 100μm sensor has a working range of up to ±16g and a failure limit of 20g The movement of a proof mass which is 74.5% of the sensor area is used to generate amplified voltage signals based on the theory of capacitance using a series of capacitive comb elements mounted on the perimeter of the sensor. Process simplification is achieved with the use of a single Silicon-on-Insulation (SOI) wafer and minimum masking material. The paper contains details on structural and motion analysis performed on the design and also contains techniques which can be used for the fabrication of the sensor and electrical contacts needed for the successful implementation of the sensor into electrical circuitry.
  • Keywords
    accelerometers; capacitance measurement; capacitive sensors; computerised instrumentation; elemental semiconductors; masks; microsensors; signal generators; silicon; silicon-on-insulator; vibration measurement; DOF; MEMS based dual axis capacitive accelerometer; SOI wafer; Si; aeronautics; amplified voltage signal generation; automobiles; biomedical application; capacitance measurement; capacitive comb element; degree of freedom; microelectromechanical system; minimum masking material; multiaxis accelerometer; process simplification; sensor; silicon-on-insulation wafer; smart electronics; vibration detection module; Acceleration; Accelerometers; Capacitance; Fabrication; Micromechanical devices; Sensors; Springs; Capacitive accelerometer; Comb drive; MEMS; SOI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Moratuwa Engineering Research Conference (MERCon), 2015
  • Conference_Location
    Moratuwa
  • Type

    conf

  • DOI
    10.1109/MERCon.2015.7112344
  • Filename
    7112344