DocumentCode
27108
Title
High Performance Compact Multilayer Circular Spiral Inductors in Advanced Photoimageable Technology
Author
Samanta, K.K. ; Robertson, I.D.
Author_Institution
Milmega/AMETEK Ltd., Ryde, UK
Volume
4
Issue
12
fYear
2014
fDate
Dec. 2014
Firstpage
1981
Lastpage
1988
Abstract
This paper presents the development and thorough analysis of a wide range of coplanar-waveguide circular spiral inductors with remarkably high performance and inductance density using advanced multilayer (ML) photoimageable thick-film (Pimage-TF) multichip module (MCM) technology. The performances of the embedded spiral inductors are thoroughly analyzed, modeled, and compared with the competitive MCM technologies and are superior to most of the published results. A new design and layout generation technique with a simplified closed form expression for circular spiral inductors is proposed. Moreover, the impact of MCM/system-on-package technologies on inductor key parameters has been explained in detail and compared with other technologies. The cost-effective Pimage-TF-based inductors demonstrate the highest level of self-resonance frequency, as well as inductance density (15 nH/$mathrm{mm}^{mathrm {mathbf {2}}}$ ) reported to date in conventional thick-film-based ML MCM technologies, including low temperature cofired ceramic.
Keywords
ceramics; coplanar waveguides; inductors; microwave integrated circuits; multichip modules; system-on-package; Pimage-TF MCM technology; Pimage-TF-based inductors; coplanar-waveguide circular spiral inductors; inductance density; inductor key parameters; low temperature cofired ceramic; multilayer circular spiral inductors; multilayer photoimageable thick-film multichip module technology; photoimageable technology; resonance frequency; system-on-package technologies; Coplanar waveguides; Inductance; Inductors; Integrated circuit modeling; Layout; Multichip modules; Spirals; Miniaturized inductor; multichip modules (MCM); mutilayer (ML) passive components; photoimageable; photoimageable.;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2014.2363819
Filename
6945899
Link To Document