• DocumentCode
    27108
  • Title

    High Performance Compact Multilayer Circular Spiral Inductors in Advanced Photoimageable Technology

  • Author

    Samanta, K.K. ; Robertson, I.D.

  • Author_Institution
    Milmega/AMETEK Ltd., Ryde, UK
  • Volume
    4
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1981
  • Lastpage
    1988
  • Abstract
    This paper presents the development and thorough analysis of a wide range of coplanar-waveguide circular spiral inductors with remarkably high performance and inductance density using advanced multilayer (ML) photoimageable thick-film (Pimage-TF) multichip module (MCM) technology. The performances of the embedded spiral inductors are thoroughly analyzed, modeled, and compared with the competitive MCM technologies and are superior to most of the published results. A new design and layout generation technique with a simplified closed form expression for circular spiral inductors is proposed. Moreover, the impact of MCM/system-on-package technologies on inductor key parameters has been explained in detail and compared with other technologies. The cost-effective Pimage-TF-based inductors demonstrate the highest level of self-resonance frequency, as well as inductance density (15 nH/$mathrm{mm}^{mathrm {mathbf {2}}}$ ) reported to date in conventional thick-film-based ML MCM technologies, including low temperature cofired ceramic.
  • Keywords
    ceramics; coplanar waveguides; inductors; microwave integrated circuits; multichip modules; system-on-package; Pimage-TF MCM technology; Pimage-TF-based inductors; coplanar-waveguide circular spiral inductors; inductance density; inductor key parameters; low temperature cofired ceramic; multilayer circular spiral inductors; multilayer photoimageable thick-film multichip module technology; photoimageable technology; resonance frequency; system-on-package technologies; Coplanar waveguides; Inductance; Inductors; Integrated circuit modeling; Layout; Multichip modules; Spirals; Miniaturized inductor; multichip modules (MCM); mutilayer (ML) passive components; photoimageable; photoimageable.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2363819
  • Filename
    6945899