DocumentCode :
27108
Title :
High Performance Compact Multilayer Circular Spiral Inductors in Advanced Photoimageable Technology
Author :
Samanta, K.K. ; Robertson, I.D.
Author_Institution :
Milmega/AMETEK Ltd., Ryde, UK
Volume :
4
Issue :
12
fYear :
2014
fDate :
Dec. 2014
Firstpage :
1981
Lastpage :
1988
Abstract :
This paper presents the development and thorough analysis of a wide range of coplanar-waveguide circular spiral inductors with remarkably high performance and inductance density using advanced multilayer (ML) photoimageable thick-film (Pimage-TF) multichip module (MCM) technology. The performances of the embedded spiral inductors are thoroughly analyzed, modeled, and compared with the competitive MCM technologies and are superior to most of the published results. A new design and layout generation technique with a simplified closed form expression for circular spiral inductors is proposed. Moreover, the impact of MCM/system-on-package technologies on inductor key parameters has been explained in detail and compared with other technologies. The cost-effective Pimage-TF-based inductors demonstrate the highest level of self-resonance frequency, as well as inductance density (15 nH/$mathrm{mm}^{mathrm {mathbf {2}}}$ ) reported to date in conventional thick-film-based ML MCM technologies, including low temperature cofired ceramic.
Keywords :
ceramics; coplanar waveguides; inductors; microwave integrated circuits; multichip modules; system-on-package; Pimage-TF MCM technology; Pimage-TF-based inductors; coplanar-waveguide circular spiral inductors; inductance density; inductor key parameters; low temperature cofired ceramic; multilayer circular spiral inductors; multilayer photoimageable thick-film multichip module technology; photoimageable technology; resonance frequency; system-on-package technologies; Coplanar waveguides; Inductance; Inductors; Integrated circuit modeling; Layout; Multichip modules; Spirals; Miniaturized inductor; multichip modules (MCM); mutilayer (ML) passive components; photoimageable; photoimageable.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2014.2363819
Filename :
6945899
Link To Document :
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