Title :
3D-FEM analysis of electromagnetic emission from PCB
Author :
Tanabe, Shinji ; Gofuku, Eishi ; Itoh, Takayuki ; Murata, Yuichiro ; Ozeki, Tatsuo
Author_Institution :
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
The emission of electromagnetic (EM) noise from printed circuit boards (PCBs) is analyzed using a three dimensional finite element method (3D-FEM). The emission of EM noise depends on the transmission line structure and ground structure including the connection between the system ground (SG) and frame ground (FG). We applied the 3D-FEM analysis to the design of a thin film transistor liquid crystal display´s (TFT-LCD) PCB. The calculation results were confirmed by experiments using model transmission lines. The 360 MHz noise emission from a strip line structure is about 1/10 of that from a microstrip line structure for a particular specification. Plural FGs generate loop currents and increase the noise emission. The distance between the noise source and FG is an important factor in deciding the noise emission
Keywords :
finite element analysis; liquid crystal displays; microstrip lines; noise; printed circuit design; radiofrequency interference; strip lines; thin film transistors; 360 MHz; 3D-FEM; EM noise; electromagnetic emission; electromagnetic noise; frame ground; ground structure; loop currents; microstrip line structure; model transmission lines; noise emission; printed circuit boards; strip line structure; system ground; thin film transistor liquid crystal display PCB; three dimensional finite element method; transmission line structure; Circuit noise; Distributed parameter circuits; Electromagnetic analysis; Electromagnetic interference; Finite element methods; Liquid crystal displays; Printed circuits; Strips; Thin film transistors; Transmission lines;
Conference_Titel :
Electromagnetic Compatibility, 1996. Symposium Record. IEEE 1996 International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-3207-5
DOI :
10.1109/ISEMC.1996.561255
