Title :
Recent advances on electrical conductive adhesives (ECAs)
Author :
Li, Yi ; Wong, C.P.
Keywords :
Conducting materials; Conductive adhesives; Conductivity; Electronics packaging; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Materials science and technology; Polymers; Soldering;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402732
