DocumentCode

2712116

Title

Molecular forensics: what killed this part? use of molecular modeling in materials development for electronic materials

Author

Iwamoto, N.

fYear

2004

fDate

12-15 Sept. 2004

Firstpage

8

Lastpage

13

Keywords

Adhesives; Bonding; Capacitive sensors; Chemicals; Chemistry; Composite materials; Forensics; Polymers; Silicon compounds; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on

Print_ISBN

0-7803-8744-9

Type

conf

DOI

10.1109/POLYTR.2004.1402733

Filename

1402733