Title :
Molecular forensics: what killed this part? use of molecular modeling in materials development for electronic materials
Keywords :
Adhesives; Bonding; Capacitive sensors; Chemicals; Chemistry; Composite materials; Forensics; Polymers; Silicon compounds; Stress;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402733
