DocumentCode
2712122
Title
Modeling fatigue behavior of electronically conductive adhesive joints under elevated temperature and humidity conditions
Author
Gomatam, Rajesh R. ; Sancaktar, Erol
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
14
Lastpage
26
Keywords
Conductive adhesives; Design engineering; Electronics packaging; Fatigue; Humidity; Life estimation; Life testing; Residual stresses; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402734
Filename
1402734
Link To Document