DocumentCode
2712146
Title
Application of critical stress intensity factors to evaluate adhesive failure at underfill/passivation interface singularities
Author
McAdams, Brian J. ; Pearson, Raymond A.
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
27
Lastpage
32
Keywords
Adhesives; Assembly; Delamination; Geometry; Microelectronics; Passivation; Semiconductor device packaging; Structural beams; Tensile stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402735
Filename
1402735
Link To Document