DocumentCode
2712160
Title
Anisotropic effect when using isotropic conductive adhesives
Author
Felba, Jan ; Moscicki, A. ; Bereski, Marcin
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
33
Lastpage
37
Keywords
Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Conductivity; Dielectric materials; Electronics packaging; Flip chip; Isolation technology; Shape; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402736
Filename
1402736
Link To Document