• DocumentCode
    2712160
  • Title

    Anisotropic effect when using isotropic conductive adhesives

  • Author

    Felba, Jan ; Moscicki, A. ; Bereski, Marcin

  • fYear
    2004
  • fDate
    12-15 Sept. 2004
  • Firstpage
    33
  • Lastpage
    37
  • Keywords
    Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Conductivity; Dielectric materials; Electronics packaging; Flip chip; Isolation technology; Shape; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
  • Print_ISBN
    0-7803-8744-9
  • Type

    conf

  • DOI
    10.1109/POLYTR.2004.1402736
  • Filename
    1402736