Title :
Modeling filler volume fraction and film thickness effects on conductive adhesive resistivity
Author :
Sancaktar, Erol ; Bai, Lan
Keywords :
Conductive adhesives; Conductive films; Conductivity; Dielectrics and electrical insulation; Electrons; Metal-insulator structures; Polymers; Powders; Shape; Tunneling;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402737
