DocumentCode :
2712279
Title :
Duromer MID technology for system in package generation
Author :
Decker, K.-F. ; Braun, T. ; Neumann, A. ; Ostmann, A. ; Koch, M. ; Bader, V. ; Aschenbrenner, R. ; Reichl, H.
fYear :
2004
fDate :
12-15 Sept. 2004
Firstpage :
72
Lastpage :
77
Keywords :
Assembly; Components, packaging, and manufacturing technology; Electronics packaging; Metallization; Optical materials; Packaging machines; Polymers; Robustness; Space technology; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
Type :
conf
DOI :
10.1109/POLYTR.2004.1402742
Filename :
1402742
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2712279
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