DocumentCode
2712279
Title
Duromer MID technology for system in package generation
Author
Decker, K.-F. ; Braun, T. ; Neumann, A. ; Ostmann, A. ; Koch, M. ; Bader, V. ; Aschenbrenner, R. ; Reichl, H.
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
72
Lastpage
77
Keywords
Assembly; Components, packaging, and manufacturing technology; Electronics packaging; Metallization; Optical materials; Packaging machines; Polymers; Robustness; Space technology; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402742
Filename
1402742
Link To Document