DocumentCode
2712296
Title
Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging
Author
Hong, Li-Ching ; Hwang, Sheng-Jye ; Lee, Huei-Huang ; Durn-Yuan Huang
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
78
Lastpage
84
Keywords
Computational modeling; Costs; Electromagnetic compatibility; Electronic packaging thermal management; Equations; Integrated circuit packaging; Plastic packaging; Predictive models; Temperature; Thermal engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402743
Filename
1402743
Link To Document