Development of Millimeter-wave Integrated Passives on MCM-D Technology with Thin-Film Microstrip Line

In this paper, we developed millimeter-wave (mm-wave) integrated passives on the high-performance MCM-D technology considering flip-chip interconnection, which has the improved electrical, thermal, and thermo-mechanical performances for the flip-chip structure. These integrated passives using thin-film microstrip (TFMS) line include the Wilkinson power divider, the broad-side Lange coupler, the balun using the broad-side Lange couplers, and the band-pass filter. The fabricated Wilkinson power divider has an insertion loss less than 0.8 dB and better than 15 dB matching and isolation over a wide frequency range for W-band (75 GHz ~ 110 GHz). The broad-side Lange coupler shows the transmission and coupling loss of 3.8 plusmn 0.2 dB and return loss better than 18 dB in W-band. The developed balun exhibits that insertion loss is less than 2.5 dB and amplitude and absolute phase imbalance is less than 1.2 dB and plusmn3deg, respectively, in W-band. And the band-pass filter for the V-band application was designed and implemented with insertion loss of 2.6 dB at 56 GHz. These high-performance integrated passives on SNU´s MCM-D technology can make mm-wave modules to be compact, high-performance, and low-manufacturing cost