Title :
Modeling of particle arrangement in an isotropically conductive adhesive joint
Author :
Windlein, M. ; Nicolics, Johann
Keywords :
Composite materials; Conducting materials; Conductive adhesives; Contacts; Electric resistance; Independent component analysis; Polymers; Probability; Solid modeling; Temperature;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402770
