DocumentCode
2713002
Title
Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing
Author
Sasangka, W.A. ; Syaranamual, G.J. ; Gan, C.L. ; Thompson, C.V.
Author_Institution
Low Energy Electron. Syst., Singapore-MIT Alliance for Res. & Technol., Singapore, Singapore
fYear
2015
fDate
19-23 April 2015
Abstract
We have investigated the role of threading dislocations in pit formation during stressing of AlGaN/GaN on Si high electron mobility transistors under high reverse bias. Upon stressing, the drain current saturation (ID-saturation) decreases over time. The amount of ID-saturation degradation correlates well with pit formation at the gate-edge, where the electric field is the highest. Using a transmission electron microscope weak-beam technique, it is found that pits tend to nucleate at threading dislocations that have a screw component, even when these dislocations are at locations away from the gate-edge. An explanation based on an electrochemical oxidation model is proposed.
Keywords
III-V semiconductors; aluminium compounds; electric fields; gallium compounds; high electron mobility transistors; silicon; transmission electron microscopy; wide band gap semiconductors; AlGaN-GaN; Si; drain current saturation; electric field; electrochemical oxidation model; gate-edge; high electron mobility transistor; physical degradation; pit formation; reverse bias stressing; threading dislocation; transmission electron microscope weak-beam technique; Aluminum gallium nitride; Degradation; Fasteners; Gallium nitride; HEMTs; Logic gates; Silicon; AlGaN/GaN; HEMT; reliability; threading dislocations;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IRPS.2015.7112768
Filename
7112768
Link To Document