DocumentCode
2713142
Title
What we expect from weakly dissipating materials at the range of plasmon resonance frequencies
Author
Yanchuk, B. S Luk ; Chong, T.C. ; Shi, L.P. ; Tribelsky, M.I. ; Wang, Z.B. ; Li, L. ; Qiu, C.W. ; Sheppard, C.J.R. ; Wu, J.H.
Author_Institution
Data Storage Inst., Agency for Sci., Singapore
fYear
2008
fDate
8-11 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
Development of modern materials, including nanoclusters, cluster assembled materials and metamaterials is among the actual challenges for the development of future nanotechnologies. Here we discuss the peculiarities of far-field and near-field light scattering by plasmonic nanoparticles, and possible applications of weakly dissipating materials. Over the last few years many peculiarities of light scattering have been found for nanoparticles in the regime of plasmon resonances. Optical excitation of localized plasmons is accompanied by inverse process - transformation of localized resonant plasmons into scattered light. When radiative damping prevails over the dissipative damping, the effects of anomalous light scattering result in sharp giant optical resonances and complicated near-field structure of the Poynting vector field, see e.g. [1-4]. Here we present peculiarities of far-field and near-field light scattering by plasmonic nanoparticles with weak dissipation and anisotropy.
Keywords
damping; inverse problems; light scattering; metamaterials; photoexcitation; plasmonics; Poynting vector field; anomalous light scattering; cluster assembled materials; far-field light scattering; inverse process; localized plasmons; metamaterials; nanoclusters; near-field light scattering; plasmon resonance frequencies; plasmonic nanoparticles; radiative damping; weakly dissipating materials; Assembly; Damping; Light scattering; Metamaterials; Nanoparticles; Nanostructured materials; Optical scattering; Plasmons; Resonance light scattering; Resonant frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
PhotonicsGlobal@Singapore, 2008. IPGC 2008. IEEE
Conference_Location
Singapore
Print_ISBN
978-1-4244-3901-0
Electronic_ISBN
978-1-4244-2906-6
Type
conf
DOI
10.1109/IPGC.2008.4781348
Filename
4781348
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