• DocumentCode
    2713162
  • Title

    Impact of process variability on BEOL TDDB lifetime model assessment

  • Author

    Croes, K. ; Kocaay, D. ; Ciofi, I. ; Bommels, J. ; Tokei, Zs

  • Author_Institution
    imec, Leuven, Belgium
  • fYear
    2015
  • fDate
    19-23 April 2015
  • Abstract
    We investigate the impact of process variability on BEOL TDDB lifetime model assessment. The change in functional form of TDDB lifetime plots due to line-to-line variability and line-edge-roughness has been quantified in the field range in which long term TDDB measurements have been obtained. We found that the Pearson R2, which is used as a measure of linearity of a lifetime plot, did not significantly change due to process variability. Where process variability has a significant effect on TDDB and needs to be taken into account during data analysis, our simulations suggest that it does not have an impact on BEOL TDDB lifetime model assessment. We propose that the conclusions from recent literature reports which point in the direction of a less conservative model compared to the √E-model are valid, although they do not take process variability into account during the data analysis.
  • Keywords
    data analysis; integrated circuit modelling; √E-model; BEOL TDDB lifetime model assessment; Pearson R2; TDDB measurement; data analysis; line-edge-roughness; line-to-line variability; process variability; Analytical models; Data models; Dielectric breakdown; Dielectrics; Physics; Reliability; BEOL; Lifetime model; TDDB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IRPS.2015.7112777
  • Filename
    7112777