DocumentCode :
2713201
Title :
The structure and properties of new metallized polyimide films with high electrooptical performances
Author :
Kudaikulova, S.K. ; Iskakov, Rinat M. ; Razumovskaja, Irina V. ; Bazhenov, Sergei L. ; Prikhodko, Oleg Y. ; Kurbatov, Andrei P. ; Akhmetov, Tleuken Z. ; Zhubanov, Bulat A. ; Abadie, Marc J M
Author_Institution :
Inst. of Chem. Sci., Almaty, Kazakhstan
Volume :
2
fYear :
2005
fDate :
12-17 Sept. 2005
Firstpage :
93
Abstract :
The specific properties and structure of new chemically metallized polyimides films were investigated by RSA, DSK, TGA methods and by measurements of the microhardness and the electrical conductivity. The surface layers represent composite material in which metal nanoparticles strengthen the polymer. The method of microhardness can be used as express-method for estimation the depth of metal particle penetration. The value of the electrical conductivity permits to estimate the thickness of "high conductivity" owing to impurities after chemical modification. The high adhesion, caused by the specific structure, makes these films prospective for new techniques.
Keywords :
adhesion; composite materials; electrical conductivity; electro-optical effects; impurities; metallisation; microhardness; nanoparticles; polymer films; thermal analysis; DSK method; RSA method; TGA method; adhesion; chemical modification; composite material; electrical conductivity; high electrooptical performances; impurities; metal nanoparticles; metal particle penetration depth; metallized polyimide films; microhardness; polyimide film structure; surface layers; Chemicals; Composite materials; Conductive films; Conductivity measurement; Electric variables measurement; Metallization; Nanocomposites; Nanoparticles; Polyimides; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Optoelectronics and Lasers, 2005. Proceedings of CAOL 2005. Second International Conference on
Print_ISBN :
0-7803-9130-6
Type :
conf
DOI :
10.1109/CAOL.2005.1553928
Filename :
1553928
Link To Document :
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